Partial nitrogen charging device for solder pot
● Stainless steel porous pipe sprays nitrogen evenly and stably.
● Nitrogen will be blocked below the PCB and from a low oxygen layer between the PCB and the solder pot surface in order to achieve high welding quality and low oxidation.
● Since it is not closed area, oxygen analyzer cannot be installed.
● 1000ppm, 12m3/h
● Test at soldering level
● Pressure: 5bar
● Flow rate: >18m3/h